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GFT R&D
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R&D
GFT strives for excellence with a “can
do” attitude and believes that there are no unsolvable
problems, only undiscovered solutions.
Customers were asking for simpler solutions
to their thermal insulation problems and GFT rose to the challenge.
In response to customer needs, exhaustive GFT R&D efforts
resulted in the  development
of a revolutionary flexible foam from hollow polyimide microspheres
… a polyimide foam that is extremely flexible, tough,
durable, resilient, and that is safe and easy to install and
use.
These patent pending technologies are
PerForma-H® VersaFlex® Polyimide Thermal and Acoustic
Insulation and PerForma-H® VersaFlex®
Foam-Filled Honeycomb and Panels.
They have all the positive attributes of the NASA-patented
polyimide TEEK-H foam made from friable balloons (produced
by GFT under the trademark PerForma-H®),
yet are less dense and do not require the custom molding,
forming, machining, or complicated assembly typically required
for installation on complex shapes such as pipe junctions
and valves.
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